Infineon Technologies presented its new embedded SIM (eSIM) solution, designed specifically for mobile consumer devices, at the world's largest mobile event, Mobile World Congress (MWC) in Barcelona, Spain from 25-28 February 2019.
Xilinx and Samsung collaborate to deliver advanced 5G solutions using forthcoming Versal ACAP.
Powered by just sunlight & body heat, the PowerWatch 2 is the first location tracking smartwatch you never need to charge.
Combining the Qi standard with NFC communication enables innovative products in automotive applications.
Anglia Components is offering users of its 80/20 inventory management system the opportunity to hold increased levels of inventory at no additional cost, ahead of any potential Brexit disruption. This additional inventory is still invoiced as it is used – eliminating any call on the customer’s financial capital.
Researchers based at The University of Manchester have developed a new low cost method for producing graphene printed electronics, significantly speeding up and reducing the cost of conductive graphene inks.
Demos include compact, power-efficient, performance-enhancing technology for pioneering consumer products.
Texas Instruments designs and manufactures analogue technologies, digital signal processing (DSP) and microcontroller (MCU) semiconductors.
LOPEC 2019 takes place in Munich next March, with the conference running from March 19 to 21, and the exhibition from March 20 to 21. The conference programme will focus on technology & business aspects of the printed electronics industry.