A miniaturised multi-layer chip bead series in case size 0603 (EIA 0201) saves volume and area, says TDK.
Described as a breakthrough in low-inductive power, modules with NPC (neutral point clamped) topology can be used for three-phase solar inverters.
CC2538 simplifies ZigBee development with an ARM Cortex-M3 microcontroller, memory and hardware security engine.
Compact, 3G-only module designed to reduce the cost of 3G M2M devices is centred on Intel’s XMM 6255 HSPA chipset.
An IP-centric design environment and C/C++ system level design libraries have been added to the Vivado Design Suite.
The M12 D-Code connectors from Provertha have been certified to DIN EN 61076-2-101 BP 3.1 for use in rough environments.
HiTek Power has added another 22 new models to its compact Series OLS10K 10kW high voltage power supplies to give a further choice of input voltage.
Lincoln-based manufacturer VxI Power has added a compact new 40W model to its Oracle family of battery-backed switch-mode power supplies, which are used in a wide variety of mission-critical applications.
NC277 VOC-free liquid flux is as electrically safe as an alcohol-based flux, with medium residue for long thermal demands, says AIM Solder.