Electronic Product Design & Test - Features

Features - Test/Measurement

Last chance: apply for A4I funding to tackle productivity problems in UK industry

Contrinex inductive sensors beat the heat on PCB reflow ovens

2D or not 2D, that is the question

First 5G smartphone data connection demo in leading UK mobile operator lab by OnePlus, enabled by Keysight

Test capability of 3GPP 5G New Radio demonstrated by Rohde & Schwarz using Qualcomm Snapdragon X50 5G modem

Enterprises can use big data & AI cybersecurity solutions to proactively prevent breaches says Frost & Sullivan

- Delivering wireless services from the sky with USRP & LabVIEW Communications (01/02/2019)
  
  Researchers at the University of York needed to implement a cost-effective, low-altitude aerial testbed that can verify novel wireless communications applications between airborne nodes and ground terminals, while meeting tight constraints for payload weight, volume and power consumption.
- New venue for ElectroTestExpo 2019 (01/02/2019)
  
  Back in 2010, a group of leading test equipment vendors planned a new forum to present the latest technological advances in electronics testing, establishing ElectroTestExpo – a co-operative event aimed at hardware design & production test engineers seeking information on the latest tool developments designed to make their jobs easier.
- Balancing innovation & risk: software in MedTech device design (01/02/2019)
  
  One of the biggest challenges in medical product design and development is remaining innovative and competitive against a backdrop of functional safety, risk management and regulatory compliance.
- Design & verification solutions for a 5G future (01/02/2019)
  
  As 5G momentum grows, and standards solidify, global expectations continue to increase. While the 3GPP releases updated 5G specifications, designers must still address issues to overcome 5G mmWave technical challenges such as large path loss, wide bandwidth & limited instrument accessibility.
- SGS helps companies access the US wireless device market (18/01/2019)
  
  Leading testing & certification business, SGS, is helping manufacturers and suppliers of wireless devices to the US market understand both CTIA Over-the-Air (OTA) Test Plan V3.8.1 and CTIA Multiple Input Multiple Output (MIMO) OTA Test Plan V1.2.
- Getting the next stage of 3D printing off the ground (02/01/2019)
  
  While the 3D printing or additive manufacturing (AM) movement has taken the world by storm, with applications from in-space manufacturing and 3D-printed aerospace components to on-site military re-supply, quality assurance and rapid process qualification remain the biggest concerns for AM technology.
- NIDays 2018: future faster… (02/01/2019)
  
  NIDays London, National Instruments’ annual user conference & exhibition in the UK, brought together >300 engineers, scientists, researchers & industry leaders to learn about industry best practices in the development, automation and performance of test & measurement systems at a brand-new central London venue, The Mermaid.
- Understanding the true costs of design failures (02/01/2019)
  
  For today’s design engineers, balancing power, heat and performance is ever more difficult. In particular, as devices become increasingly complex, compact and ‘smart’, with more and more sensing capabilities, intelligence and connectivity built in, thermal performance rises in importance, since excessive heat can lead to higher failure rates.
- The Fourth Industrial Revolution: powered by AI & machine learning (02/01/2019)
  
  We are being met with a tidal wave of new and disruptive technology, as the digital revolution that underpins the Fourth Industrial Revolution gathers momentum. Artificial intelligence (AI) has become the buzz word – but will all the hype live up to our expectations?

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