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      High-accuracy temperature measurements in any environment (07/09/2018)

      Although temperature measurement is a common requirement for many applications, developers face significant challenges in ensuring highly accurate results. In this tutorial, Digi-Key Electronics explains how overcoming these challenges often leads to complex designs and extended design cycles – but also how new measurement devices are helping reduce the complexity.

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      Q&A with Qoitech founder: optimising energy consumption for IoT devices (05/09/2018)

      After working on field testing with many partners, Qoitech CEO Vanja Samuelsson (VS) and her team identified a common need for a compact, flexible, everyday measurement tool. Reluctantly, Samuelsson founded Qoitech, a Sony Group start-up, to develop and bring to market their Otii solution: a comprehensive toolkit for energy optimisation of IoT devices. EPDT Editor Mark Gradwell (MG) interviewed VS to learn more about Otii…

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      Board approval: the benefits of PCBA testing (03/09/2018)

      The majority of electronic devices rely on printed circuit board assemblies (PCBAs) – and it is critical that these are properly tested to identify any production or component faults, as this piece explains…

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      Test engineering – an essential luxury? (01/08/2018)

      Many professionals lament that ‘test engineering’ is often considered a poor relation to the other engineering activities undertaken during an electronics product's lifecycle. But this is only true if you see test as the only ‘non-essential’ part of the design and production process...

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      NIWeek 2018: Future faster… (10/07/2018)

      NIWeek, NI's annual global user conference, brings together thousands of industry professionals to learn about the NI software-centric platform for accelerating productivity in T&M systems. 'Future faster', 2018’s theme, focused on accelerating time-to-market through open-platform systems, powerful software and improved networking capabilities.

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      Put to the test: T&M sector investment stands strong (03/07/2018)

      The global T&M industry has been gathering momentum, driven by a strong underlying market and increasing mergers and acquisitions (M&A), volumes and valuations. As this piece maintains, global M&A involving T&M companies have hit a record high – with the UK reinforcing its position as the second largest market.

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      Why modular instrumentation is critical for system-level test (07/05/2018)

      System-in-package (SiP) technologies are making a significant impact on the electronics supply chain, as the semiconductor industry strives to meet the perpetual demand for higher performance, smaller size and lower cost.

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      Metal-oxide (MOX) gas sensor testing using a PXI test system (04/05/2018)

      MOX gas sensors are MEMS (micro-electromechanical systems) devices fabricated as multi-chip modules (MCM). The basic components of the MCM are the microcontroller ASIC, pre-tested on the wafer, and the sensor itself. These components are sited on a common substrate and a lid is placed over the components, with a small hole or mesh that allows gas into the sensor. This piece outlines how PXI test systems can be used to test and validate such devices. 

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      PXI: 20 years young – and still growing (04/05/2018)

      2018 marks the 20th anniversary of PXISA. Few people predicted the success of PXI in 1998, when the PXISA was formed with only a handful of products available. Initially perceived as a low-performance platform, PXI has since far exceeded users’ expectations – becoming the dominant modular standard for T&M systems.