• Article image

      Why modular instrumentation is critical for system-level test (07/05/2018)

      System-in-package (SiP) technologies are making a significant impact on the electronics supply chain, as the semiconductor industry strives to meet the perpetual demand for higher performance, smaller size and lower cost.

    • Article image

      PXI: 20 years young – and still growing (04/05/2018)

      2018 marks the 20th anniversary of PXISA. Few people predicted the success of PXI in 1998, when the PXISA was formed with only a handful of products available. Initially perceived as a low-performance platform, PXI has since far exceeded users’ expectations – becoming the dominant modular standard for T&M systems.

    • Article image

      Applications that benefit from PXI oscilloscopes (03/05/2018)

      Oscilloscopes offer a variety of features that are optimised for capturing, displaying and analysing signal waveforms, making them the tool of choice for many benchtop test applications. But as this piece explains, thanks to PXI, ATE environments can now benefit from these same features – including large displays, touch operation, waveform zoom and simple controls that enable the acquisition of difficult-to-capture errors and anomalies.

    • Article image

      Thermochromism compensation enables 100% inline inspection in plastics production (07/03/2018)

      Naturally, for consumer devices, colour (or multiple colours) is a key consideration, both from a branding perspective and to make the product as appealing as possible to consumers. However, verifying correct colour consistency via inline inspection is challenging for manufacturers. This piece discusses a potential solution for production lines.

    • Article image

      Cellular connectivity for IoT: the case for NarrowBand-IoT (06/02/2018)

      As the economies of scale provided by the 3GPP ecosystem help drive down prices, NB-IoT will apply well to long-range connectivity of devices with low data rate, low mobility requirements. This piece reviews why testing of low cost IoT devices is still critical to ensure optimum battery performance and minimal interference.

    • Article image

      Do more, with less: the challenges of maintenance in a digital & wireless world (02/02/2018)

      As the IoT continues to proliferate and touch nearly every point in our lives, the need to manage the maintenance of millions of wired and wireless endpoints in hugely complex networks becomes a daunting task. This piece outlines some of the key challenges and potential solutions.

    • Article image

      The benefits of cloud computing in the manufacturing industry (16/01/2018)

      The domestic canary isn’t what many of us would consider an obvious tool for industrial labour. Today, connectivity advancements and cloud computing are making industrial environment monitoring much more sophisticated than the former. As we enter the era of the smart factory, COPA-DATA discusses the benefits of cloud computing for the manufacturing industry.

    • Article image

      Testing and deploying the next generation of technology (02/01/2018)

      NIDays, National Instruments’ annual graphical system design conference and exhibition, brought together several hundred like-minded engineers and scientists from many industries at a brand-new venue, Sandown Park Racecourse, Esher. This piece reports on the event.

    • Article image

      Challenges in wireless test system design (10/11/2017)

      People are increasingly relying on their wireless and mobile devices to manage email and banking – and even to download or stream music, on-demand TV and movies. With consumers demanding ever higher mobile data rates and better signal integrity, wireless providers are developing new techniques to improve connectivity and achieve higher peak mobile data rates.