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      Q&A with Qoitech founder: optimising energy consumption for IoT devices (05/09/2018)

      After working on field testing with many partners, Qoitech CEO Vanja Samuelsson (VS) and her team identified a common need for a compact, flexible, everyday measurement tool. Reluctantly, Samuelsson founded Qoitech, a Sony Group start-up, to develop and bring to market their Otii solution: a comprehensive toolkit for energy optimisation of IoT devices. EPDT Editor Mark Gradwell (MG) interviewed VS to learn more about Otii…

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      Board approval: the benefits of PCBA testing (03/09/2018)

      The majority of electronic devices rely on printed circuit board assemblies (PCBAs) – and it is critical that these are properly tested to identify any production or component faults, as this piece explains…

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      Test engineering – an essential luxury? (01/08/2018)

      Many professionals lament that ‘test engineering’ is often considered a poor relation to the other engineering activities undertaken during an electronics product's lifecycle. But this is only true if you see test as the only ‘non-essential’ part of the design and production process...

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      NIWeek 2018: Future faster… (10/07/2018)

      NIWeek, NI's annual global user conference, brings together thousands of industry professionals to learn about the NI software-centric platform for accelerating productivity in T&M systems. 'Future faster', 2018’s theme, focused on accelerating time-to-market through open-platform systems, powerful software and improved networking capabilities.

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      Put to the test: T&M sector investment stands strong (03/07/2018)

      The global T&M industry has been gathering momentum, driven by a strong underlying market and increasing mergers and acquisitions (M&A), volumes and valuations. As this piece maintains, global M&A involving T&M companies have hit a record high – with the UK reinforcing its position as the second largest market.

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      Why modular instrumentation is critical for system-level test (07/05/2018)

      System-in-package (SiP) technologies are making a significant impact on the electronics supply chain, as the semiconductor industry strives to meet the perpetual demand for higher performance, smaller size and lower cost.

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      Metal-oxide (MOX) gas sensor testing using a PXI test system (04/05/2018)

      MOX gas sensors are MEMS (micro-electromechanical systems) devices fabricated as multi-chip modules (MCM). The basic components of the MCM are the microcontroller ASIC, pre-tested on the wafer, and the sensor itself. These components are sited on a common substrate and a lid is placed over the components, with a small hole or mesh that allows gas into the sensor. This piece outlines how PXI test systems can be used to test and validate such devices. 

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      PXI: 20 years young – and still growing (04/05/2018)

      2018 marks the 20th anniversary of PXISA. Few people predicted the success of PXI in 1998, when the PXISA was formed with only a handful of products available. Initially perceived as a low-performance platform, PXI has since far exceeded users’ expectations – becoming the dominant modular standard for T&M systems.

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      Simulating the tough challenges with PXI (03/05/2018)

      The testing requirements nowadays include factors such as increased sensor simulation, fault insertion, higher data rates and increased precision. All of this must be accomplished while increasing test throughput and lowering costs. As this piece explains, in many cases, the solution has been PXI – which has proved a remarkably flexible platform.