To support rising wireless data demand, modern base station radios are being designed to support multiple E-UTRA bands, as well as carrier aggregation techniques. These multiband radios employ next-generation, GSPS RF ADCs & DACs that allow frequency-agile, direct RF signal synthesis and sampling techniques.
A paradigm shift, often referred to as Industry 4.0 (or Industrie 4.0 in Germany), is taking place. Thomas Brand, Field Applications Engineer at semiconductor manufacturer, Analog Devices, explains how this is impacting the semiconductor industry.
From ultra-thin sensors that monitor body functions to lab-on-a-chip for quick tests at the patient’s bedside: printed electronic components expand the possibilities of medical diagnostics. LOPEC, the leading exhibition & conference for the printed electronics industry, will focus on new developments in MedTech from March 19 to 21, 2019 in Munich.
Sensors, lights or displays: more and more electronic components in the automotive sector are being printed – and there are no limits to the design. From March 19 to 21, LOPEC 2019 in Munich will showcase new developments & trends for printed electronics – including a focus on applications in automotive.
Graphene Flagship industrial & academic partners have published a new paper analysing the possibilities of graphene in the Internet of Everything (IoE) market, expected to reach over 12 billion connected devices by 2020.
Engineers face a constant battle to reduce the size and weight of electronic components. Moore’s law supposes that the number of transistors in a dense integrated circuit doubles approximately every two years.
How much integration is possible while still meeting macrocell base station performance requirements?
Good reception in cars is ensured by an increasing number of transmit and receive antennas from a variety of radio systems located in close proximity to one another.
The world of industrial automation is entering the fourth industrial revolution.