Highly reliable solutions for microelectronics

26 April 2013

Henkel debuted highly reliable adhesives, solder materials and underfills innovations at SMT trade show in Nürnberg

Remaining flexible when exposed to vibrational energy, the Loctite Ablestik ICP 4000 series adhesives are capable of surviving extreme vibration over extended periods of time while retaining their high bond strength and conductivity. They are also superior to traditional epoxy materials with respect to their ability to withstand heat. At temperatures up to 200 degrees Celsius, these single-component, silver-filled silicone adhesives have a low contact resistance.

Further innovations in single-component electrically conductive adhesives are designed to ensure fail-safe bonds, simplify assembly processes, and reduce production costs. With Loctite Ablestik ICP 3540, Henkel has succeeded in developing a versatile epoxy adhesive that is especially suited for automotive applications. It is capable of attaching dies as well as other components in one process step and can be used on both organic and ceramic substrates. This not only saves time but significantly reduces operating costs. Moreover, the adhesive shows no signs of delamination even under large dies, nor any wicking with very small package sizes such as 0402. This new material enhances Henkel’s existing portfolio of versatile and reliable adhesives for more cost-effective production processes.

Henkel's halogen-free products – from fluxes and solder pastes to underfills – provide solutions that perform convincingly even in the most demanding production environments. The perfectly matched products in this portfolio enable optimal adaptation to customer-specific production requirements, all from the same provider.

Halogen-free and lead-free, the solder paste Loctite Multicore HF 200 features a particularly impressive high print speed capability. With its humidity resistance and low voiding, the product has already proven its worth in numerous soldering processes, including applications in handheld devices. The market-leading lead-free flux system Loctite Multicore LF 318 shows excellent humidity resistance and a broad processing window for both reflow and printing processes. This halide-free product offers outstanding solderability in different types of reflow processes as well as on different surfaces finishes.

The two solder pastes Loctite Multicore HF 200 and Loctite Multicore LF 318 are compatible with the lead-free solder alloys that Henkel offers for demanding high-temperature applications, among others. This powerful portfolio ensures highly reliable results for a large spectrum of soldering processes.

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