SMART Group to Present European Conference and Exhibition 2012

16 July 2012

The SMART Group is to host its annual two day conference and table top exhibition on Tuesday 18 and Wednesday 19 September, 2012 at the Spread Eagle Hotel in Oxfordshire, UK.

The hotel has been carefully selected by the SMART Group as the new venue in 2012 for this not-to-be-missed event.

Planned Conference Topics Include:

DAY 1

Keynote Presentation: Printed Circuit Boards to Printed Electronics - The Future: Steve Jones - Printed Electronics Ltd

Thermal Cycle Solder Joint Integrity of BGA Connectors for High Performance Products: Dave Hillman -Rockwell Collins

Electronics Design for Vibration: Andy Stiles - Aero Engine Controls

SMART HALT: Bob Page – Reliability Plus

Assembling HDI PCB Designs - Real World Experiences From the Coal Face: Gareth Beckett - Axiom Manufacturing Services

High Reliability Board Fabrication and IPC-A-600 Class 3: Wim Perdu - Advanced Circuit Boards NV

Miniaturization - Solder Paste Attributes for Maximizing the Print & Reflow Manufacturing Process Window: Karthik Vijay - Indium

Stencil Technology - State of the Art: Lucian Ripperger - Christian Koenen

Discussions Forum - "Counterfeit Components" and "Where to Next for Electronics?": Graham Naisbitt - SMART Group

DAY 2

DFM – Why Can’t People Communicate?!: Sue Knight - STI Ltd

A Practical View on the Introduction of Package On Package Assembly: Bob Willis - EPS

Cleaning Under Low Stand-off Components: Rob Murphy - Zestron

Assessment of Reterminated RoHS Components for Sn-Pb Applications: Chris Hunt/Martin Wickham - NPL

Lessons Learned - Aqueous-Based Conformal Coating: Doug Pauls - Rockwell Collins

Lead-free Paste Characterization (Wetting & Voiding) vs Reliability: Joerg Trodler - Heraeus

DfM and DfR - Their Application for Hi-Rel Electronics Manufacture: Charles Cawthorne - MBDA(UK)

ESD Control in Automated Assembly and Handling Systems: Jeremy Smallwood - Electrostatic Solutions Ltd

The Last Will and Testament of the Lead-free BGA Void: Dave Hillman -Rockwell Collins

This event is ideally suited to any member of staff working in electronics manufacturing and design. Managers will also benefit from a fuller understanding of the issues currently being experienced in our industry. Delegates can choose to attend either of the days or both. The costs for delegates include arrival drinks, mid-morning drinks, lunch, afternoon drinks and full access to all the proceedings immediately after the event.

Two Day Conference Pass: £195+VAT for SMART Group Members/ £350+VAT for non-members

One Day Conference Pass: £99+VAT for SMART Group Members/ £195+VAT for non-members

Each space booked allows for the cost of one delegate attending.

For enquiries on this event please email:

info@smartgroup.org.


Print this page | E-mail this page