MicroSense wins first 300 mm wafer MRAM magnetic metrology tool orders
02 July 2012
MicroSense, LLC, has announced that it has booked multiple customer orders for its MRAM (Magnetoresistive Random Access Memory) magnetic metrology systems from global semiconductor manufacturers.
These metrology tools characterise the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM.
"We have shipped a number of first generation MRAM metrology tools since 2004, but the industry had difficulty scaling for several years," said Tom McNabb, President and COO of MicroSense. "Now with STT-MRAM (Spin Transfer Torque MRAM) emerging as the solution to the scaling problem, it appears the industry is once again in motion. This has resulted in a number of new MRAM tool orders for MicroSense. We are pleased to announce receiving orders for our new 300 mm Polar Kerr (out-of-plane) MRAM metrology system, in addition to orders for our KerrMapper(TM) (in-plane) tool and our Vibrating Sample Magnetometers (VSM)."
According to Ferenc Vajda, Ph.D., Director of Magnetic Metrology at MicroSense: "These systems are the world's first full 300 mm wafer, non-contact magnetic metrology systems for perpendicular and in-plane MRAM, providing critical process control information on the multi-layer magnetic stack that is an essential component of MRAM fabrication. These metrology tools utilise our proprietary capabilities in magnetic field control and complex algorithms that result in world leading performance. Our systems can measure wafers up to 300 mm and are applicable to R&D and production needs."