Direct Thermal Exchange (DTE) configurations for LED assemblies
02 July 2012
Direct Thermal Exchange (DTE) design in printed circuit boards intended for LED arrays provides a direct thermal path to the base metal of the assembly, allowing the high-power LEDs to dissipate heat effectively, extending their working life and safety in overall functioning.
Electronic Interconnect (EI), a provider of printed circuit boards and PCB engineering and design services, now offers Direct Thermal Exchange for LEDs. Thermal Management designs and engineering are an area of specialisation and focus for EI.
“DTE enables a very fast thermal transfer through the LTE pad,” said the company’s President, Pratish Patel. “This is an important enabling technology for LED-bearing circuits, especially those intended for outdoor lighting and emergency vehicles where heat dissipation is an ever-increasing concern as the technology of high-power LEDs advances.”
Any base metal thickness can be used and any typical dielectric can be used, including FR-4, epoxy, and polyimide. Additionally, no PCB design change is required, so the technology can be implemented simply, quickly, and at minimum cost without undue complications.