Hitachi expands sales and service of large board size solder paste printer
28 May 2012
Sales and service for the recently-introduced HP-07 and HP-08 solder paste printers has been expanded to the Americas.
The newly introduced HP-07 and HP-08 solder paste printers can accommodate large size printed circuit boards with a range from 50mm x 50mm to 620mm x 510mm, with an extremely fast cycle rate, making both models suited to work in conjunction with Hitachi PSD’s flagship Sigma G5 high speed modular mounter.
The HP-07 and HP-08 are designed and manufactured by Hitachi Plant Technologies, Ltd. (HPT), a sister company of Hitachi High-Technologies Corporation under the same Hitachi group. Excellent printing quality and very fast cycle time coupled with easy operation are ensured by HPT’s features including:
• Unique side board clamping, which eliminates the gap between board and stencil
• Synchronous squeegee technology, which keeps a constant printing pressure on warped PCBs
• Direct Drive stencil snap-off control
The Synchronous Squeegee controls both squeegee parallelism and Z-axis balance through the use of HPT’s unique cylinder which precisely compensates for bumps or deformation in the board surface, resulting in a very reliable printing process. Additionally, technicians are not required to adjust the squeegee level, only to set printing pressure to obtain constant and stable printing. Finally, stencil snap-off is an exceptionally smooth process because the stencil is free from unnecessary printing pressures from the squeegee.
Hitachi High Technologies America will support HPT’s printers in North and South America from its headquarters in Dallas, Texas and has officially started installations in the US as of May 2012. HTA will utilise both Hitachi Plant Technologies’ powerful solder paste printer together with their own Sigma series high speed modular mounters as a single line solution to accommodate customer’s demands.
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