New system for 3D solder paste inspection
14 May 2012
GOEPEL electronic recently introduced a new system for 3D solder paste inspection (SPI). The solution, named OptiCon SPI-Line 3D, provides high level technology by extraordinary inspection speed and detection accuracy for automatic solder paste inspection.
The SPI system will be offered in three different configurations determined by pixel resolutions of 10 µm, 15 µm and 20 µm. An inspection speed of up to 90cm² can be achieved.
The OptiCon SPI-Line 3D is fully compliant to all OptiCon AOI systems from GOEPEL electronic, allowing for previously unknown opportunities in PCB production process optimisation.
The core element is a specifically developed 3D camera head functionally based on the fringe projection principle, operating without moving parts.
In connection with a newly designed drive system for assemblies and measuring head, a reliable monitoring of the solder paste printing at extraordinary speed is guaranteed.
The completely new developed user interface SPI-Pilot provides efficient, reliable and simple programming. An offline programming station and a module for statistic process control (SPC) evaluation are offered as add-on options.
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