Halide-free, lead-free, water soluble solder paste
21 November 2011
Alpha WS-820 halide-free, lead-free, water-soluble solder paste is now available throughout the UK and Ireland from the Solder Connection.
This new generation solder paste offers outstanding printability with excellent print volume and print repeatability down to 0.3mm (12 mil) features. It also has an excellent reflow process window with straight ramp and short soak or long soak profiles in air.
WS-820 is designed to provide excellent print performance at both low and high relative humidity (20% to 65%), and it offers IPC 7095 Class III resistance to voiding. It is also very easy to clean with warm de-ionized water, leaving virtually no ionic contamination behind.
Available from stock in SAC305 alloy and in Type 3 and Type 4 powders, Alpha WS-820 delivers excellent wetting characteristics on all common surface finishes, including Entek HT OSP.
As many electronics assemblers renew their interest in lead-free water-washable surface mount applications in the lead-free era, WS-820 allows many of them to make the transition without sacrificing printability and first pass yields.
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