Power MOSFETs with compact package
11 January 2011
The new package combines thermal and electrical properties in a small surface area.
Renesas Electronics has unveiled several new Power MOSFETs that feature a compact HSON-8 package; making them suitable for use in automotive electronics systems such as engine management and pump motor control.
Measuring 6.0mm x 5.2mm x 1.45mm, the HSON-8 package has the same footprint as a SOP-8 package. Compared to the DPAK (TO-252), its mounting area is reduced by half, while maintaining the DPAK’s good thermal and electrical properties.
It can handle currents of up to 75A and can be used in conjunction with Renesas Electronics’ UMOS-4 Trench technology to achieve an on-resistance RDS(on) of 5.1 milliohms (mΩ) for N-channel modules with VDSS=40V (for the NP75N04YUG product); and an RDS(on) of 6.2 mΩ for P-channel modules with VDSS=-30V (for the NP75P03YDG product).
The new HSON-8 product range comprises a total of nine N-channel Power MOSFETs with nominal voltages of 40V, 60V, 75V and 100V as well as three P-channel Power MOSFETs with -30V and -40V.
All the modules are suitable for use in automotive applications, such as to switch inductive loads and various types of motors as well as to protect against reversed battery conditions.
The Power MOSFETs enable system manufacturers to develop more compact automotive electronics control units and to make more efficient use of the limited space available in vehicles.
As with all the products in Renesas Electronics’ Power MOSFET N-Series, all the modules are qualified to AEC-Q101 automotive standards and comply with RoHS regulations.
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