Redesigned Temprobe for high-value PCB thermal T&M

01 November 2018

Credit: ECD

Thermal profiling leader ECD, designer and developer of M.O.L.E.-brand thermal measurement systems, have announced the release of its redesigned Temprobe non-destructive temperature sensing technology.

The temperature measurement tool, used primarily for high-value assemblies where conventional thermocouples are not an option, has been re-engineered for increased robustness and longevity.
“By nature, temperature sensing devices that are not mechanically attached to the PCB [printed circuit board] are delicate,” explains Mark Waterman, product manager at ECD M.O.L.E.

“Their construction requires the use of materials that can accurately and repeatably measure temperature of key locations on the PCB without any tape or solder – and that’s a challenging balance to strike.

“The new Temprobe design effectively unites durability and temperature sensitivity for repeatable, long-term use and highly accurate PCB temperature measurement.”
Temprobe’s redesign has dramatically improved its ruggedness, and all while its high process effectiveness for high-cost PCBs remains unaffected. When boards are so valuable that sacrificing one assembly for temperature measurement and characterisation is out of the question, Temprobe is a trusted choice for manufacturers who require the right profiling.

The device can be quickly placed directly on the PCB, and the miniaturised thermocouple tip is capable of precise temperature measurement of critical solder joints and components – even in wet solder paste or on fine-pitch component leads.

Compatible with all M.O.L.E. and competitive thermal profilers, Temprobe is ideal for PCBs built for military, aerospace, sonar, radar, computing, as well as some medical applications (where assembly value is high and margin for error non-existent).

ECD explain that, with the new design, Temprobe’s return on investment is at its highest.
For more information about the re-engineered Temprobe technology, visit

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