An iSAC load of developments
28 October 2009
Provider of alloyed solder anodes, Balver Zinn, will show their i-SAC series of optimised Alloyed Lead-Free Solders at Productronica.
The company will present products in this new family of solders, based on the ‘Iowa State Patent’, for which they hold a license.
First in the line up is i-SAC 387 Solder, with the addition of Cobalt (Co). The melting characteristic of silver containing alloys has been improved with the addition of Cobalt to offer an optimised lead-free solder solution. Cobalt produces shiny solder joints with a fine grain microstructure, in comparison to standard SnAg3.8Cu0.7. i-SAC387 Solder also has the addition of Germanium (Ge), which plays the role of antioxidant, preferentially reacting with oxygen to protect the solder from the oxidation that results in the formation of dross. i-SAC387 has a melting point of
217°C and a specific gravity of 7.5g/cm3.
The second in the new series is Tin Silver based i-SAC Solder Family i-SAC105. The melting characteristic of silver containing alloys has been improved with the addition of Cobalt (Co). Solder i-SAC105, with silver composition on request between 0.5 – 1.5%, offers the advantages of silver free alloys and the characteristics of silver containing alloys. i-SAC105 produces low priced, bright and shiny solder joints and a fine grain microstructure, even with this low addition of silver content. As with the previous product, Cobalt is responsible for a homogenous microstructure in comparison to standard SnAg alloys. A formulation including Germanium (Ge) again plays the role of antioxidant, preferentially reacting with oxygen to protect the solder from the oxidation that results in the formation of dross. i-SAC105 has a melting point of 217°C to 227°C and a specific gravity of 7.4g/cm3.
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