New classification released
08 September 2008
Jointly developed by IPC, JEDEC and ECA (Electronic Components Association), J-STD-075 (Classification of Non-IC Electronic Components for Assembly Processes) is a document that expands on existing standards.
It provides test methods and classification levels to identify the worst-case thermal process limitations for electronic components that may be processed as part of a circuit card assembly. This includes passives, connectors, switches and other devices.
Jack Crawford, IPC Director of certification and assembly technology said: “Users have long been struggling with component damage that occurs during processing. J-STD-075 provides classifications to cover the increased pre-heat, reflow or wave soldering temperatures that can cause components to melt, warp, crack, delaminate, or even explode. Another potential source of damage involves cleaning processes.”
According to Crawford, J-STD-020 (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Devices) is limited to moisture-related issues of nonhermetic integrated circuits. “The new standard expands the coverage to all components,” he adds.
Furthermore, J-STD-075 (which supersedes IPC-9503) includes classification categories to identify cleaning process sensitivity. There is also a ‘wild-card’ option that component manufacturers can use to identify process issues not covered by this standard. J-STD-075 references the packaging and labelling requirements of J-STD-033 (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices).
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