Design and assembly process implementation for BGAs released

21 April 2008

IPC

IPC - Association Connecting Electronics Industries has announced the release of IPC-7095B, Design and Assembly Process Implementation for BGAs.

Implementing BGA (ball grid array) and FBGA (fine-pitch ball grid array) technology presents challenges for design, assembly, inspection and repair personnel, especially in light of recent changes in alloys and surface finishes. IPC-7095B offers practical information to anyone currently using BGAs or considering a conversion to area array packaging formats.

Committee chair Ray Prasad said: “This version focuses on the design and assembly issues of lead-free BGAs along with applications that use tin-lead and lead free on the same board, including various solder ball alloys, new laminate materials for lead free, BGA trace escape and routing considerations during board design to improve yield and reduce cost.”


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