IPC releases Revision B of IPC-7711/7721

04 February 2008


IPC - Association Connecting Electronics Industries has announced the release of Revision B of IPC-7711/7721, rework, modification and repair of electronic assemblies.

The revision involved a complete review and update of every rework and repair procedure to ensure applicability to both lead-free and traditional tin-lead soldered assemblies. “The Revision B document is without a doubt the most inclusive, cost effective avenue to assist the technician in utilising guidelines for both tin-lead and lead-free rework and repair processes,” said Peggi Blakley, Industry Liaison, NSWC Crane. “This new document also provides a technician with the ability to review ‘what to look for’ guidelines when inspecting completed work. This document is truly a technician’s must-have item,” added Blakley.

The guide was developed in three parts. General requirements has been updated for ease of use and provides important direction and guidelines for all procedures, including those common to rework, repair and modification. Part two focuses on the tools, materials and methods to be used in removing and replacing surface mount and through hole components, whereas the final part details the procedures for modifying assemblies and accomplishing laminate can conductor repairs.

This single-volume guide includes all previously published changes and several new procedures for BGAs (including reballing) and flex-print repair. Colour illustrations of many of the procedures have also been added to help users understand the guide.

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